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INTEGRATED CIRCUITS
DATA SHEET
TJA1010 Octal Low Side Driver (OLSD)
Preliminary specification File under Integrated Circuits, IC18 1998 Feb 09
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
FEATURES * Eight independent low side drivers * Small outline/medium power package for surface mounting, SO28 (20 + 4 + 4) * Serial input control by writing to internal shift register * Overvoltage clamping for each driver * Each driver protected against short-circuited load * Undervoltage shutdown * All logic pins CMOS microcontroller compatible * Standby mode for minimum current consumption * Two status outputs indicating short-circuited load and open load respectively at any driver stage * Channel selective diagnostic information available by reading from internal shift register * Serial output allows cascading of several OLSDs * Outputs can be used in parallel * Two-stage thermal protection * Power-on reset. QUICK REFERENCE DATA SYMBOL VDD Vo(clamp) Ro(on) Io PARAMETER supply voltage drain-to-source clamp voltage on resistance output current CONDITIONS operating load dump Io = 20 mA Io = 0.2 A continuous at all outputs; Tamb = 85 C MIN. 5.5 - 50 - - TYP. - - 60 - - GENERAL DESCRIPTION
TJA1010
The TJA1010 is an octal low side driver for relays in automotive applications.
MAX. 25 50 70 3 0.2
UNIT V V V A
ORDERING INFORMATION TYPE NUMBER TJA1010T PACKAGE NAME SO28 DESCRIPTION plastic small outline package; 28 leads; body width 7.5 mm VERSION SOT136-1
1998 Feb 09
2
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latch D Q OL SC serial clock parallel load serial input clock
BLOCK DIAGRAM
Philips Semiconductors
Octal Low Side Driver (OLSD)
handbook, full pagewidth
VDD 24
STBY
25
SUPPLY AND REFERENCE
0V
TEMPERATURE PROTECTION
TJA1010
UV power-on serial input master reset 8-BIT LATCH parallel outputs data inputs data outputs CURRENT LIMITING 1 3 12 14 15 8-BIT SHIFT REGISTER parallel inputs clock 17 26 Vref 28 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8
1 & & &
DELAY
1
2, 13 16, 27
GND1 to GND4
&
Tstat
&
Preliminary specification
10 SO
4 SCL SI
5
11 SIE
6 to 9 20 to 23 GND
19 STATOL
MBH994
18 STATSC
TJA1010
Fig.1 Block diagram.
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
PINNING SYMBOL OUT1 GND1 OUT2 SCL SI GND GND GND GND SO SIE OUT3 GND2 OUT4 OUT5 GND3 OUT6 STATSC STATOL GND GND GND GND VDD STBY OUT7 GND4 OUT8 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 output 1 ground 1 output 2 serial clock input serial input ground ground ground ground serial output serial input enable output 3 ground 2 output 4 output 5 ground 3 output 6 status output short-circuited load status output open load ground ground
MBH990
TJA1010
DESCRIPTION
handbook, halfpage
OUT1 1 GND1 2 OUT2 3 SCL 4 SI 5 GND 6 GND 7
28 OUT8 27 GND4 26 OUT7 25 STBY 24 VDD 23 GND 22 GND
TJA1010
GND 8 GND 9 SO 10 SIE 11 OUT3 12 GND2 13 OUT4 14 21 GND 20 GND 19 STATOL 18 STATSC 17 OUT6 16 GND3 15 OUT5
ground ground supply voltage standby input output 7 ground 4 output 8 Fig.2 Pin configuration.
1998 Feb 09
4
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
FUNCTIONAL DESCRIPTION (see Figs 1, 3 and 4) This octal low side driver is intended to drive relays in automotive applications. It is optimized to withstand the wide temperature and supply voltage range that is typical for this application area. It consists of 8 protected outputs, including diagnostic functions, controlled by a serial interface. These outputs can be used in parallel without the need for additional components. Serial control interface Serial control of the drivers is provided by an 8-bit shift register with parallel outputs and an 8-bit latch which controls the DMOS output stages. Using this configuration the number of pins needed for control of the eight drivers is reduced to three; Serial Input (SI), Serial CLock (SCL) and Serial Input Enable (SIE). When pin SIE is LOW, serial data at pin SI is shifted into the shift register at each HIGH-to-LOW transition at the SCL pin and serial data is shifted out at the Serial Output (SO) pin at a LOW-to-HIGH transition on the SCL pin. The last bit read in before a LOW-to-HIGH transition at the SIE pin is bit D8. A HIGH level at the SI pin causes a driver to switch-on. With a LOW-to-HIGH transition at the SIE pin, parallel output data in the shift register is written to the 8-bit latch, which controls the DMOS outputs. When SIE is HIGH, signals at pins SI, SCL and SO are disabled. For pin SO this results in a HIGH level because pin SO is an open-collector output. Diagnostic interface The OLSD detects open loads and short-circuited loads at each driver stage by comparing its output voltages (Vo) to a reference voltage (Vref). To allow distinction between short-circuit and open load conditions, a short-circuit is detected for Vo > Vref in the on-state, while an open load is detected for Vo < Vref in the off-state of a driver stage. In both cases the corresponding status pin is set to a LOW level and the respective bit in the shift register is inverted on a HIGH-to-LOW transition of SIE. By writing a following byte into the shift register, its actual contents (the control byte eventually modified by errors) can be read out via pin SO. Comparing this byte with the original control byte previously written, faults can be localized and identified (e.g. open load at driver stage number 5). Protection of DMOS outputs Each driver contains a DMOS power FET. The drivers are protected against overvoltage, short-circuit and overtemperature conditions. 1998 Feb 09 5
TJA1010
An overvoltage clamp circuit at each driver causes the respective DMOS power FET to turn partially on, if its drain-to-source voltage level exceeds the clamp level [Vo(clamp)]. Consequently each driver can withstand voltage peaks caused by turning off inductive loads, such as relays coils without freewheel diodes. It should be noted that if outputs are used in parallel the amount of inductive energy which can be handled will not increase but will remain equal to that of a single output. Each driver is protected against a short-circuited load by current limiting. In the event of a short-circuited load at a driver stage, the current will be limited and the HIGH level of its drain-to-source voltage will force the comparator output to go HIGH. This in turn will set the STATSC pin to a LOW level. A two-stage temperature protection circuit is included to protect the device against overheating caused by high dissipation in the output transistors. When the temperature exceeds the overtemperature threshold level, it will switch-off those outputs with a short-circuit condition for the duration of the overtemperature condition. The status and diagnostic function will not be influenced. If the chip temperature still rises and exceeds the emergency threshold level, the emergency shutdown will become active and shut down all of the outputs until the temperature drops below the overtemperature threshold. The outputs are fully protected against short-circuit to battery conditions for the whole supply voltage range. To protect the outputs against device threatening dissipation peaks, the overtemperature control is extended with local power dissipation sensors. If one or more outputs dissipate too much power all outputs with a short-circuit condition will be switched off for the duration of the local overtemperature condition. To protect the outputs against high dissipation during load dump, an overvoltage protection is included. This will switch-off those outputs with a short-circuit condition if the supply voltage exceeds the overvoltage threshold VDD(0 V) for the duration of the overvoltage condition. The diagnostic and status information will not change due to the interference of the overvoltage and overtemperature protections. To avoid a false LOW signal at the SC pin due to switching transients at the DMOS outputs, the SC pin is disabled for a sufficient delay time whenever a new input control byte has been written into the 8-bit latch with a LOW-to-HIGH transition of SIE.
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
Other features When using several OLSDs, input control and diagnostics can be provided, as described above, without spending further microcontroller pins by cascading, i.e. connecting the SO pin of one OLSD to the SI pin of the following OLSD. A standby input (STBY) pin allows the off state current consumption in the OLSD to be minimized. Thus the OLSD can be connected permanently to a battery. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Vn VI(STBY) Vo(STAT) Vo(SO) Io Io(con) Iclamp(rep) Eclamp(rep) Eclamp(nrep) Tvj Tstg Vesd PARAMETER supply voltage input voltage at pins SI, SCL and SIE input voltage at pin STBY output voltage at pins STATOL and STATSC output voltage at pin SO output current continuous output current Tj = 135 C Tj = 95 C repetitive inductive turn-off current per Tj = 135 C; note 1 output repetitive inductive turn-off energy per Tj = 95 C; notes 1 and 2 output non-repetitive inductive turn-off energy per output virtual junction temperature storage temperature electrostatic handling human body model machine model Notes Tj = 95 C; notes 1 and 3 transient CONDITIONS continuous 0 0 0 0 0 0 -0.2 -0.3 see Fig.5 - - -40 -55 - - 5 60 MIN.
TJA1010
A power-on reset ensures a defined off state for all drivers when the device is switched on i.e. by switching on the power supply or by activating the device via the STBY pin. Thus the STBY input can also be used as a reset pin.
MAX. 25 50 5.5 7 18 18 +0.2 +0.3 V V V V V V A A A
UNIT
internally limited
mJ mJ C C kV V
+135 +150 3 300
1. The amount of Eclamp per output can NOT be added if outputs are used in parallel. Thus, if two or more outputs are used in parallel it can handle the Eclamp of one output. 2. Defined for tclamp = 1 ms. 3. Defined for tclamp = 5 ms.
1998 Feb 09
6
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
THERMAL CHARACTERISTICS SYMBOL Rth (j-amb) Rth (j-sp) Notes 1. Printed on an FR-4 board with minimum foot print. 2. Power uniformly divided over all outputs. PARAMETER from junction to ambient in free air from junction to soldering point of ground pins 6 to 9 and 20 to 23 CONDITIONS note 1 note 2 VALUE 55 17
TJA1010
UNIT K/W K/W
CHARACTERISTICS Tj = -40 to +135 C; VDD = 11 to 13.5 V; Vbat(max) = VDD + 1.5 V. All voltages are defined with respect to ground. Positive currents flow into the IC. All parameters are guaranteed over the temperature range by design, but only 100% tested at Tamb = 25 C; unless otherwise specified. SYMBOL IDD PARAMETER supply current CONDITIONS Io = 0 mA; VSTBY > 3 V VSTBY < 1 V; VDD = 13 V; Tj = -40 to +85 C VDD(UV) VDD(0V) Vo(clamp) ILO undervoltage shutdown threshold overvoltage protection threshold output clamp voltage output leakage current (one output) Io = 20 mA off-state, Vo = 13 V; standby off-state, Vo = 13 V; operational off-state, Vo = 1 V; operational Io(lim) Ro output current limit (one output) output resistance (one output) on-state Io = 0.2 A; VDD = 13 V; Tj = 135 C Io = 0.2 A; VDD = 13 V; Tj = 25C Io = 0.1 A; VDD = 5.5 V; see Fig.6 Vref Io/t VIH Vi(hys) VIL VIL(STBY) open load/short-circuit reference voltage maximum rise and fall time of output current HIGH-level input voltage at pins SI, SCL, SIE and STBY input voltage hysteresis at pins SI, SCL and SIE LOW-level input voltage at pins SI, SCL and SIE LOW-level input voltage at pin STBY 7 note 2 note 1 VDD = 13 V; RL = 100 ; note 2 - - 2 25 50 - 70 40 0.3 - - - 1 - 3 0.2 - - - - - - - - - - - - - - MIN. - - - - 60 TYP. MAX. 5 10 4.3 33 70 10 210 180 0.55 3 2.5 10 1.9 100 - 1.2 0.8 1 UNIT mA A V V V A A A A V mA/s V V V V
1998 Feb 09
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
TJA1010
SYMBOL Ii ILI Ri(STBY) Ii(STBY) VSTAT(L) VSO(L) ILO(SO) fclk tW(SCL) td(SIE-SCL) tsu(SIE-SCL) td(SCL-SO) tsu(SI-SCL) th(SCL-SI) th(SCL-SIE) tsu(STBY) th(STBY) td(STAT) Tth(otc) Tth(ets) Notes
PARAMETER input leakage current at pins SI, SIE and SCl input resistance at pin STBY input current at pin STBY status LOW voltage serial output LOW voltage output leakage current at pin SO and status outputs clock frequency SCL positive pulse width delay time from SIE HIGH to SCL LOW set-up time from SIE LOW to SCL HIGH delay time from SCL HIGH to SO valid set-up time from SI to falling edge of SCL hold time from falling edge of SCL to SI hold time from SCL LOW to SIE HIGH STBY set-up time from STBY HIGH to SIE LOW STBY hold time from SIE HIGH to STBY LOW delay time for status pin enable threshold overtemperature control threshold emergency temperature shutdown note 3
CONDITIONS off-state; Vi = 3 V; Tj = 85 C; VSTBY < 1 V Vi = 1 V; Tj < 85 C Vi = 3 V ISTAT(L) = 1.6 mA ISO = 1.6 mA off-state; Vo = 5 V; VSTBY < 1 V; Tj < 85 C HIGH-to-LOW transition -
MIN. 20 - - - - - - - - - - - - - - - - -
TYP.
MAX. 60 5 150 60 0.4 0.4 10 1 - - - 250 - - - - - 250 - -
UNIT A A k A V V A MHz ns ns ns ns ns ns ns s s s C C
input current at pins SCL and SIE Vi = 3 V
40 20 - - - - 500 100 250 - 150 150 250 100 10 40 - -
100 170 190
1. Open load is indicated for Vo < Vref in the off-state, short-circuited load is indicated for Vo > Vref in the on-state. 2. Guaranteed by design. 3. Delay caused by load excluded.
1998 Feb 09
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Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
TJA1010
handbook, full pagewidth
SIE
SCL
shift register bit n
(1)
B n+1
SI
D1 new
D2 new
D3 new
D4 new
D5 new
D6 new
D7 new
D8 new
SO
previous D8
D1 old
D2 old
D3 old
D4 old
D5 old
D6 old
D7 old
D8 old
OUT1
corresponding to D1 old
corresponding to D1 new
OUT2
corresponding to D8 old
corresponding to D8 new
MBH992
(1)
Inverting only when error (open load/short-circuit).
Fig.3 Serial interface timing.
1998 Feb 09
9
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
TJA1010
andbook, full pagewidth
5V tsu(STBY) th(STBY) 70%
STBY 0V 5V
SIE 16% td(SIE-SCL) SCL 16% tsu(SI-SCL) th(SCL-SI) 70% SI don't care td(SCL-SO) 70% SO previous valid 16% 0V
MBH993
0V
tw(SCL)
td(SCL-SIE) 70% 5V
0V
5V
valid 16% 0V
5V
Fig.4 Input and output waveform timing.
handbook, full pagewidth I
0.16 clamp (A) 0.14
MGL379
0.12
0.10
0.08
0.06
0.04
0.02
0 0 100 200 300 400 500 t (s) 600
The curve is based on behaviour of relays; Siemens A4001-X40.
Fig.5 Maximum current during inductive turn-off (Tamb = 85 C).
1998 Feb 09
10
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
TJA1010
handbook, full pagewidth
12
MGL380
Ron ()
10
8
6
4
2
0 5 6 7 8 9 10 11 12 13 14 VDD (V) 15
Fig.6 Maximum on-resistance as a function of supply voltage.
handbook, full pagewidth
+5 V REGULATOR 100 nF C2 VDD STBY SIE SCL SI MICROCONTROLLER R1 +5 V R2 R3 SO STATSC OL GND
D1 Vbat 100 F C1
OUT1 OUT2 OUT3 OUT4
load load load load load load load load
MBH991
TJA1010
OUT5 OUT6 OUT7 OUT8
Fig.7 Application example.
1998 Feb 09
11
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
PACKAGE OUTLINE SO28: plastic small outline package; 28 leads; body width 7.5 mm
TJA1010
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1998 Feb 09
12
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TJA1010
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Feb 09
13
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TJA1010
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Feb 09
14
Philips Semiconductors
Preliminary specification
Octal Low Side Driver (OLSD)
NOTES
TJA1010
1998 Feb 09
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
Internet: http://www.semiconductors.philips.com
SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
615102/00/01/pp16
Date of release: 1998 Feb 09
Document order number:
9397 750 01763

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